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Xiaomi has unveiled the AI Cube, an engineering prototype mini PC built around three of its own Xring chips for running AI models on-device. The company showed the machine at its Xring chip technology conference on August 24, with CEO Lei Jun confirming the prototype on Weibo.

Three chips, three jobs. The AI Cube combines the Xring O3, O100, and D100, with each chip handling a different role. Xiaomi says the three-chip design can deliver up to 150W of sustained performance.

The Xring O3 is the flagship SoC, with a 10-core CPU, a 16-core G2-Ultra NX GPU, and a 200 TOPS NPU. It is built on a 3nm process with 24 billion transistors, and Xiaomi says it is the first mobile processor to support LPDDR6. The O3 is set to debut in the Xiaomi 18 Fold this September.

For high-bandwidth AI workloads, the Xring O100 is a dedicated accelerator built on a 6nm process with wafer-on-wafer 3D stacking. Xiaomi says it reaches up to 1.22TB/s of near-memory compute bandwidth, with on-device inference of up to 330 tokens per second.

The Xring D100, meanwhile, is a 3nm chip designed for high-performance AI and intelligent driving workloads. It carries a 20-core CPU and a 16-core NPU, and supports up to 160GB of unified memory for deploying models with up to 200 billion parameters locally.

Design and software. The AI Cube uses an aerospace aluminum unibody shell with 33,874 CNC precision perforations, according to Xiaomi. The prototype runs 120B and 3B large models side by side, switching between fast and slow systems depending on the task.

Pricing and availability. Xiaomi has not yet announced a release date or price for the AI Cube, which remains an engineering prototype. The company says the O100 and D100 chips are planned for commercial launch in 2027, and there is no word yet on availability in the Philippines.

Xiaomi AI Cube specs:
Chips: Xring O3, O100, D100
Performance: up to 150W sustained, per Xiaomi
AI: local deployment of 120B and 3B models, fast and slow system switching
Memory: up to 160GB unified memory via the D100; 1.22TB/s bandwidth via the O100
Chassis: aerospace aluminum unibody with 33,874 CNC precision perforations
Status: engineering prototype, no release date or price